U.S. Department of Commerce, National Institute of Standards and Technology
CHIPS Incentives Program
Key facts
- Open now
- 1 grant
- Type of help
- Direct payment for a set purpose, loan, loan guarantee
- Typical award
- The value of any direct funding (grant, cooperative agreement, or other transaction agreement), loan or guarantee will be determined on a case-by-case basis, based on the distinctive characteristics of individual projects.
- Deadlines
- Contact the headquarters or regional location, as appropriate for application deadlines
This program offers loans or loan guarantees, which must be repaid.
Open now
- CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment · Due Nov 1, 2026 · 21 days left
What it pays for
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security.
Who can apply
An applicant must be a �covered entity.� A �covered entity� means a nonprofit entity; a private- sector entity; a consortium of private- sector entities; or a consortium of nonprofit, public-, and private- sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.
How applications are judged
Specific criteria are listed in the Notice of Funding Opportunity posted at www.grants.gov.
Match
None required (federal program listing).