National Institute of Standards and Technology · Department of Commerce
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
In short: A grant from National Institute of Standards and Technology.
Key facts
- Deadline
- Due Nov 1, 2026 · 21 days left
- Award size
- Not stated: see the official notice
- Match ?
- Not required · Work out your budget and match
- Who can apply
- Set by the official notice: see Who can apply below
- Where
- Anywhere in the U.S., including Tennessee
How this fits you
- Available in Sumner County (nationwide program)
- No match required
Tell us who you are to see whether you're eligible.
About this grant
Who can apply, from the official notice
Official notice: https://simpler.grants.gov/opportunity/00ce4809-b5ff-479a-ac47-bfbf09abdccb · Printed from grantme.click/grants/369a2dc8-6921-4706-a933-83120b391c68
View on Grants.gov Add deadline to my calendar
Your schedule, working back from the deadline
- Oct11
Check that your SAM.gov registration is active (or start it now)
Grants.gov: allow up to 10 business days for SAM registration, weeks or months if information isn't verified. It must be renewed every year. Grants.gov - Oct11
Ask partners for letters of support or commitment
Suggested: partners need about three weeks to write and sign letters. - Oct26
Finish a complete draft for a final review
Suggested: leave about a week for someone else to read the draft. - Oct30
Submit
Grants.gov: submit at least 24–48 hours before the deadline: uploads fail, systems slow down, errors need fixing. Grants.gov blog - Nov1
Deadline
From the funder.
Save this grant to put these dates in My grants and your private calendar.
Writing the need statement? Sumner County facts with citations.
What the official notice requires
Pulled from the official notice CHIPS_-_Facilities_for_Semiconductor_Materials_and_Manufacturing_Equipment_NOFO.pdf (45 pages) so you can see the requirements at a glance. Each item shows the notice's own words. Open the page to read it in context.
Registrations you need first (1)
SAM.gov, Unique Entity ID (UEI) · p. 26
“Applicants should make efforts to complete the process of registering for the System for Award Management (SAM.gov), including obtaining a Unique Entity Identifier (UEI), prior to submitting a full application.” Open page 26
The deadline is in 21 days. If your registration isn't already active, it may not be ready in time, so check it today. Get-ready checklist
What to submit
Letters of support or commitment · p. 26
“evidence could include, for example, company financials demonstrating the availability of cash; commitment letters; or other approaches to accessing the required funding. o Capital Investment:” Open page 26
Memorandum of understanding (MOU) · p. 28
“If applicable, any documentation and evidence of the planned operating model, such as the governance structure, decision-making authority/rights, contractual obligations, financial obligations, roles and responsibilities, and any memoranda of understanding…” Open page 28
Audit or financial statements · p. 29
“Applicants should note any commitments that have made or intend to make in CHIPS R&D initiatives, including commitments to participate in the NSTC. 60 See 15 U.S.C. § 4651(2). 61 If an applicant does not have access to audited consolidated financial…” Open page 29
Resumes or bios of key staff · p. 33
“The applicant should include one-page resumes for (a) all key construction management personnel and (b) all key personnel of contractors and any other entities that will play substantial roles in the construction of the project.” Open page 33
Organizational chart · p. 33
“Include an organizational chart of management and other key personnel for the facility, including contractors and any other entities that will play substantial roles in operating the proposed project.” Open page 33
Environmental documentation · p. 33
“Each applicant must also provide the requested information in the Environmental Questionnaire using the appropriate template on the CHIPS Incentives Program application portal: one template is for applicants proposing to construct a new facility, and one is…” Open page 33
Form CD-511 · p. 36
“CD-511, Certification Regarding Lobbying.” Open page 36
Form SF-LLL · p. 36
“SF-LLL, Disclosure of Lobbying Activities (if applicable) 76 See 15 U.S.C. § 4652(a)(2)(B)(ii)(II). 77 See CHIPS Act of 2022, Sec. 104(c)(3).” Open page 36
Form SF-424 · p. 37
“In addition, applicants may be required to submit additional standard forms, such as the SF-424 and SF-424A/C/D, during the application review process.” Open page 37
Form SF-424A · p. 37
“In addition, applicants may be required to submit additional standard forms, such as the SF-424 and SF-424A/C/D, during the application review process.” Open page 37
Indirect cost rate agreement · p. 37
“Applicants with a negotiated indirect cost rate agreement must ensure all uses of Federal funds are charged as direct costs in the categories listed in Section I.B.6.” Open page 37
Length limits
Consortium: 5 pages max · p. 24
“Consortium Narrative (if applicable) Consortium members must also upload a separate consortium narrative of no more than 5 pages.” Open page 24
Concept Plan Details: 15 pages max · p. 25
“Concept Plan Details Each applicant must submit a project plan of no more than 15 pages that describes the project for which CHIPS Incentives funds are being requested.” Open page 25
Consortium: 8 pages max · p. 27
“Consortium Narrative (if applicable) Consortium members must also upload a separate consortium narrative of no more than 8 pages.” Open page 27
Describe: 10 pages max · p. 29
“Alignment with Economic and National Security Objectives Describe how the project meets economic and national security objectives in no more than 10 pages.” Open page 29
Page limit (see quote): 3 pages max · p. 31
“This strategy must identify the type of semiconductor materials or equipment the applicant will produce at the project facility and the customers, or categories of customers, for those materials or equipment.67 In no more than 3 pages, this section should…” Open page 31
CHIPS Incentives: 5 pages max · p. 31
“Financial Information A sound financial plan is also a component of having an executable plan to sustain the proposed facility without additional CHIPS Incentives.68 Each applicant must provide a financial plan in no more than 5 pages (excluding attachments…” Open page 31
Page limit (see quote): 8 pages max · p. 32
“In no more than 8 pages (excluding attachments to support details), the applicant should include the following:” Open page 32
How applications are scored (15 points listed)
The availability and credibility of non-CHIPS funding sources for the project: 15 points · p. 38
“The availability and credibility of non-CHIPS funding sources for the project (15 points).” Open page 38
Mistakes that get applications rejected (4)
Outside what the program funds: Such projects will be deemed nonresponsive to this NOFO absent a compelling economic or national security... · p. 6
“Such projects will be deemed nonresponsive to this NOFO absent a compelling economic or national security justification.11 Fourth, the CHIPS Act specifies that the covered entity must have a documented interest in constructing, expanding, or modernizing an…” Open page 6
Missing a required part: Concept plans determined to be ineligible, incomplete, or nonresponsive will be rejected. · p. 40
“Concept plans determined to be ineligible, incomplete, or nonresponsive will be rejected.” Open page 40
Could get your application rejected: However, the Department, in its sole discretion, may continue the review process for a 81 Further... · p. 40
“However, the Department, in its sole discretion, may continue the review process for a 81 Further submissions by the same applicant for the project proposed in a concept plan the Department chooses not to advance will not be reviewed or considered.” Open page 40
Could get your application rejected: When the due diligence phase is substantially complete, the Department and the applicant will negotiate... · p. 41
“When the due diligence phase is substantially complete, the Department and the applicant will negotiate the applicable terms of the CHIPS Incentives Award. 82 Further submissions by the same applicant for the project proposed in a denied application will not…” Open page 41
Files from the official listing
The notice, forms and templates the agency attached. Some programs ask for a letter of intent or a form before the full application.
- CHIPS_-_Facilities_for_Semiconductor_Materials_and_Manufacturing_Equipment_NOFO.pdf (628 KB)
2023-NIST-CHIPS-SMME-01 - 2023-NIST-CHIPS-SMME-01-Amendment.pdf (415 KB)
2023-NIST-CHIPS-SMME-01 Amendment
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About the federal program
CHIPS Incentives Program
Program number 11.037 (the federal Assistance Listing number) · U.S. Department of Commerce, National Institute of Standards and Technology · Direct payment for a set purpose, loan, loan guarantee
How applications are judged
Match
None required (federal program listing).