National Institute of Standards and Technology · Department of Commerce
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Key facts
- Deadline
- Due Nov 1, 2026 · 26 days left
- Award size
- Not specified — see notice
- Cost share / match ?
- Not required
- Who can apply
- Other (see eligibility)
- Where
- Anywhere in the U.S., including Tennessee
Before you apply: federal grants require an active SAM.gov registration (Unique Entity ID) and a Grants.gov account. The deadline is in 26 days. If your registration isn't already active, it may not be ready in time, so check it today. Grant-ready checklist
How this fits you
- Available in Tennessee (nationwide program)
- No cost share required
Tell us who you are to see whether you're eligible.
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Official notice: https://simpler.grants.gov/opportunity/00ce4809-b5ff-479a-ac47-bfbf09abdccb · Printed from grantme.click/grants/369a2dc8-6921-4706-a933-83120b391c68
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About this grant
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Eligibility (from the notice)
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
About the program (11.037)
CHIPS Incentives Program
How applications are judged
Specific criteria are listed in the Notice of Funding Opportunity posted at www.grants.gov.
Matching requirements
This program has no statutory formula.
Matching requirements are not applicable to this assistance listing.
MOE requirements are not applicable to this assistance listing.
Examples of funded projects
Not Applicable.